A new white paper seeks to prevent fab failures before they start by detailing critical linear motion guidance for semiconductor manufacturing machinery OEMs and fab engineers.

Reliable linear motion is an absolute operational necessity in a semiconductor fab. From a prevention standpoint, semiconductor manufacturing machinery OEMs must monitor even relatively rare failure risks in linear motion components or systems throughout design and manufacturing.

The stakes are enormous, with failure of a single part or system costing a fab hundreds of thousands of dollars for even a relatively short-duration downtime event — or even more depending on location, severity, and response time for repair or replacement.

The new, 3,000-word report details how to specify, design, and install next-generation linear motion systems in semiconductor manufacturing machinery used in metrology, wire or die-bonding, wafer dicing and scribing, and packaging.

Titled “Preventing Fab Failures Before They Start: Linear Motion Tips for Semiconductor Manufacturing Machinery OEMs and Fab Engineers,” available for immediate download.

The paper is provided by SCHNEEBERGER Inc., a leading global innovator in linear technology. For more information, visit schneeberger.com.